The composition of the plating solution directly affects the quality and performance of the coating.
Author: Marisa
The composition of the plating solution directly affects the quality and performance of the coating. The plating solution is generally composed of main salt, auxiliary salt, buffer, brightener, etc. The main salt provides the metal ions required for the coating, the auxiliary salt adjusts the conductivity and deposition rate of the plating solution, the buffer controls the pH value of the plating solution, and the brightener improves the appearance of the coating.
When preparing the plating solution, it is necessary to strictly follow the process requirements to ensure that the concentration and proportion of each component are appropriate, while maintaining the purity of the plating solution and avoiding impurity contamination.
Configuration of plating tank and electrode
The plating tank is a container for electroplating operations, usually made of corrosion-resistant materials (such as PVC, PP, etc.), with plating solution and electrodes inside. The electrode is divided into anode and cathode. The anode material is generally the metal to be plated, and the cathode is the substrate to be plated.
The design of the plating tank needs to consider the fluidity and stirring method of the plating solution to ensure that the plating solution is evenly in contact with the substrate surface. The configuration of the electrode should be reasonable to ensure uniform distribution of the electric field and avoid excessive or too small local current.
Control of electroplating current and voltage
Current and voltage are important parameters that affect the quality of the coating. During the electroplating process, the current density and voltage should be reasonably selected according to the characteristics of the substrate and the electroplating solution to ensure the uniform deposition of metal ions. Generally speaking, low current density is suitable for fine electroplating, and high current density is suitable for fast electroplating.
The control of current and voltage can be achieved through a constant current power supply or a constant voltage power supply. Modern electroplating processes often use intelligent control systems to achieve precise regulation and real-time monitoring of current and voltage.